XIE zhipeng,Professor&PhD Supervisor,Materials Science of Tsinghua University
|Welcome Speech from Organizers||
HAN xiuping,Director,Uniris Exhibition Shanghai Co., Ltd.
|9:10-9:20||Speech by sponsor representative||
LIU wei, General Manager,Xi'an Xinyi Electronic Technology Co., Ltd.
|9:20-9:30||Book gift ceremony||
Uniris Exhibition Shanghai Co., Ltd.
SONG zhongxiao,Professor,Xi'an Jiaotong University
|09:30-12:00||Synthesis of AlN Powder and Its Application in High Thermal Conductivity Products||QIN Mingli,Professor, University of Science and Technology Beijing /Xiamen JuCi Technology Co., Ltd.|
|Application of Kyocera Ceramic Technology in Sensor||ふくとめ ゆうじ,Minister,KYOCERA Corporation|
|Tape Casting Process & Equipment of High-Precision Ceramic Substrate||WU An, General Manager,Beijing Orient Sun-tec Co.,Ltd.|
|Application & Development of High-performance Ceramic Substrates In IGBTt Power Devices||LIU Guoyou,Vice President, Zhuzhou Crrc Times Electric Co., Ltd.|
|Development & Packaging Applications in Electroplated Ceramic Substrate (DPC) Technology||CHEN Mingxiang,Dean/Professor&PhD Supervisor,Huazhong University of Science and Technology|
QIN Mingli,Professor, University of Science and Technology Beijing
/Xiamen JuCi Technology Co., Ltd.
|13:30-17:00||Development & Recent Advances in the Application of the 3rd Generation Semiconductor Silicon Carbide Wafer||WANG Wenjun,Researcher,Institute of Physics,Chinese Academy of Sciences|
|Development on Zirconia Ceramic Substrate & Solid Oxide Fuel Cell||CHEN Shuoshuo, Associate Aean,Chaozhou Three-Circle (Group) Co., Ltd.|
|New Technology for Rapid Synthesis & Preparation of High-Performance Silicon Nitride Powder||LI Jiangtao,Researcher, Technical Institute of Physics and Chemistry,CAS|
|Tape Casting & Sintering Technology on High Thermal Conductivity Silicon Nitride Ceramics||ZHENG Yu, Doctor, Sinoma Advanced Nitride Ceramics Co..Ltd.|
|Tape Casting Technique of Al2O3/ZTA Ceramic Substrate with New Progress||WU Chongjuan,Technical Support,Zhengzhou Zhongci Technology Co.,Ltd.|
|Application & Development Status of High Thermal Conductivity Aluminum Nitride Substrate and Its Devices||ZHAO Dongliang,Director of R&D Center,Hebei Sinopack Electronic Technology Co.,Ltd.|
|Discussion on Copper-Covering Technology & Development of Ceramic Substrate||DAI Yunhao,Vice President,Zhejiang TC Ceramic Electronic Co., Ltd.|
|17:00-18:00||Forum ( Interaction Between Experts and Representatives)||XIE zhipeng,Professor&PhD Supervisor,Materials Science of Tsinghua University|